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QAIPM-2002-Ch-2796: NEET 2002 Chemistry - Class 12 AIPM-2002-Ch-2796 Solution: In the silver plating of copper, \(K[Ag(CN)_2]\) is used…
In the silver plating of copper, is used instead of . The reason is
Multiple Choice Options
- A a thin layer of Ag is formed on Cu
- B more voltage is required
- C ions are completely removed from solution
- D less availability of ions, as Cu can not displace Ag from ion.
Step-by-Step Verified Solution
Copper being more electropositive readily precipitate silver from their salt (Ag + ) solution.
Cu + 2AgNO 3 _ Cu(NO 3 ) 2 + Ag
In K[Ag(CN) 2 ] solution a complex anion [Ag(CN) 2 ] � is formed so Ag + ions are less available in the solution and Cu cannot displace Ag from this complex ion.